Introduces the system packaging of optoelectronic devices
Optoelectronic device system packaging Optoelectronic device system packaging is a system integration process to package optoelectronic devices, electronic components and functional application materials. Optoelectronic device packaging is widely used in optical communication system, data center, industrial laser, civil optical display and other fields. It can be mainly divided into the following levels of packaging: chip IC level packaging, device packaging, module packaging, system board level packaging, subsystem assembly and system integration.
Optoelectronic devices are different from general semiconductor devices, in addition to containing electrical components, there are optical collimation mechanisms, so the package structure of the device is more complex, and is usually composed of some different sub-components. The sub-components generally have two structures, one is that the laser diode, photodetector and other parts are installed in a closed package. According to its application can be divided into commercial standard package and customer requirements of the proprietary package. The commercial standard package can be divided into coaxial TO package and butterfly package.
1.TO package Coaxial package refers to the optical components (laser chip, backlight detector) in the tube, the lens and the optical path of the external connected fiber are on the same core axis. The laser chip and backlight detector inside the coaxial package device are mounted on the thermic nitride and are connected to the external circuit through the gold wire lead. Because there is only one lens in the coaxial package, the coupling efficiency is improved compared with the butterfly package. The material used for the TO tube shell is mainly stainless steel or Corvar alloy. The whole structure is composed of base, lens, external cooling block and other parts, and the structure is coaxial. Usually, TO package the laser inside the laser chip (LD), backlight detector chip (PD), L-bracket, etc. If there is an internal temperature control system such as TEC, the internal thermistor and control chip are also needed.
2. Butterfly package Because the shape is like a butterfly, this package form is called butterfly package, as shown in Figure 1, the shape of the butterfly sealing optical device. For example, butterfly SOA（butterfly semiconductor optical amplifier）.Butterfly package technology is widely used in high speed and long distance transmission optical fiber communication system. It has some characteristics, such as large space in the butterfly package, easy to mount the semiconductor thermoelectric cooler, and realize the corresponding temperature control function; The related laser chip, lens and other components are easy to be arranged in the body; The pipe legs are distributed on both sides, easy to realize the connection of the circuit; The structure is convenient for testing and packaging. The shell is usually cuboid, the structure and implementation function are usually more complex, can be built-in refrigeration, heat sink, ceramic base block, chip, thermistor, backlight monitoring, and can support the bonding leads of all the above components. Large shell area, good heat dissipation.
Post time: Dec-16-2024